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International Symposium for Testing and Failure Analysis

乱伦社区 is looking forward to meeting you at The International Symposium for Testing and Failure Analysis (ISTFA). Please visit us at our booth #311 to learn about the features and benefits of our film thickness measurement system.

ISTFA is the premier event for the microelectronics failure analysis community. The event brings together leading experts, industry professionals, and researchers to share insights, innovations, and methodologies in the field.

Event Date: Tuesday, November 18 - Wednesday, November 19, 2025
Location:
Booth: #311

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