Process development, Process qualification, Process tool monitoring, Process tool qualification, Chamber matching, Process tool matching
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_ In Situ Process Management
_乱伦社区’s comprehensive portfolio of SensArray? products enables in situ monitoring of process tools’ environments and wafer handling conditions. With wired and wireless sensor wafers, an automation package and data analysis systems, SensArray products provide comprehensive information, including wafer temperature, for a wide range of wafer processes. They also support characterization of wafer handling and spinning chucks. Semiconductor wafer manufacturers use SensArray data to visualize, diagnose and control process and wafer handling conditions.
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SensArray? Automation
In Situ Temperature Measurement Automation Package
The SensArray? Automation in situ process management package provides a fast automated collection of process tool chamber temperature measurements while also providing semi-automated functionality to support fab startups. The SensArray Automation package includes the AS1000 automation base station, which is compatible with all 300mm wireless SensArray products, the overhead track (OHT) compatible FOUP, a system automation controller, and office PC software seat components. SensArray FOUPs can support two separate SensArray products for flexible fab deployment and can be processed the same way as any production FOUP, with direct data porting to SPC charts. SensArray Automation provides productivity enhancements resulting in gains in the availability of process tools, more efficient use of engineering resources, and centralized data storage in the fab’s MES database.
Smartwafer?
Wafer Handling Monitor
The Smartwafer2? handling monitor and in situ mechanical tester runs through process equipment and records vibrations and acceleration along its route. After completing the recording process, the data is downloaded to a PC via an external reading station. The in situ mechanical testing data is synchronized with the equipment sequence of events and compared to the historic good fingerprint. Any abnormal signals indicate and pinpoint bad mechanical components or alignments, which can cause particles, defects or scratches on the wafer. Standard 300mm silicon wafers are used to closely match the behavior of a standard process wafer, allowing it to run the same mechanical recipe through the wafer handling system. The electronic circuit is conformal coated with silicon adhesive, protecting and waterproofing the Smartwafer2. The Automation Loadport is designed for 300mm automated fabs and permits the utilization of the Smartwafer2 in production mode, like any other routine monitor. The Automation Loadport meets all SEMI standards, including E84 and other SEMI standards required for AMHS/OHV and host connectivity.
Process tool qualification, Process tool monitoring, Process tool matching
EWG Wafer?
Wafer Handling Monitor
The EWG Wafer? handling monitor measures the eccentricity and the wobbling of wafers on spinning chucks, the only in situ method of making these measurements. The common method currently used for checking these parameters involves the time-consuming process of opening the tool chamber and using mechanical gauges. With one XY accelerometer positioned at the center of the wafer and Z accelerometers positioned at six points close to the edge of the wafer, the EWG Wafer avoids any tool opening, and can be fully automated with the compatible Automation Loadport. The Automation Loadport is designed for 300mm automated fabs and permits the utilization of the EWG Wafer in production mode, like any other routine monitor. The Automation Loadport meets all SEMI standards, including E84 and other SEMI standards required for AMHS/OHV and host connectivity.
Process tool qualification, Process tool monitoring, Process tool matching
RH Wafer?
Wafer Handling Monitor
The RH Wafer? handling monitor travels throughout a process tool and measures relative humidity in multiple locations. The relative humidity sensor and Smartwafer2? type circuit are mounted on a 300mm bare silicon wafer that is placed in a purged SmartFOUP?. The SmartFOUP is then placed on a process tool N2 purged load port and monitors the functionality of the N2 purging by measuring the relative humidity in the FOUP. The RH Wafer and purged SmartFOUP are fully compatible with the Automation Loadport and analysis software for fully automated monitoring. The Automation Loadport is designed for 300mm automated fabs and permits the utilization of the RH Wafer in production mode, like any other routine monitor. The Automation Loadport meets all SEMI standards, including E84 and other SEMI standards required for AMHS/OHV and host connectivity. The analysis software uses statistical process control (SPC) tools to detect relative humidity irregularities or trends.
Process tool qualification, Process tool monitoring, Process tool matching
Integral Implant i3
In Situ Ion Implant Wafer Temperature (15° to 130°C) Measurement System
The Integral Implant i3 in situ wafer temperature measurement system, available in both 300mm and 200mm configurations, supports monitoring of wafer temperature for ion implant processes. The Integral Implant i3 wireless wafer produces high accuracy temporal and spatial wafer temperature data that can help implant engineers characterize and monitor thermal variations that affect the ion implant dose and uniformity and improve implant process qualification and tool matching.
Process development, Process qualification, Process tool monitoring, Process tool qualification, Process tool matching
Ion Implant | 15-130°C
Process Probe? 1530/1535
In Situ Wafer Temperature Monitoring System
The Process Probe? 1530 and 1535 instrumented wafers are used to monitor in situ temperatures for a wide range of processes, including cold wall, RTP, sputtering, CVD, plasma strippers and epitaxial reactors. The Process Probe 1530 and 1535 provide direct, real-time measurement of wafer temperature during each critical step of the process cycle. With this comprehensive temperature data, process engineers can characterize and fine tune process conditions, driving improved process equipment performance, wafer quality and yield.
Process development, Process qualification, Process tool qualification, Process tool matching
Cold wall thin film process chambers (1530), Hot wall thin film process chambers (1535) | 0-1100°C
Process Probe? 1630
In Situ Wafer Temperature Monitoring System
The Process Probe? 1630 instrumented wafers enable precise in situ characterization of wafer temperature profiles for front end atmospheric and belt CVD systems and back end wafer solder bumping reflow ovens. With the Process Probe 1630, process engineers can determine edge-to-center temperature profiles to adjust heater zone set points, and measure drift in deposition temperature to adjust for heat transfer changes from oxide build-up on the heaters and belts.
Process development, Process qualification, Process tool qualification, Process tool matching
Thin film APCVD, Solder bump reflow ovens | 0-800°C
Process Probe? 1730
In Situ Wafer Temperature Monitoring System
The Process Probe? 1730 instrumented wafers enable precise in situ characterization of wafer temperature profiles in photoresist track systems, temperature controlled wafer chuck systems, oven applications, and resist bake, polyimide, and SOG applications. The Process Probe 1730 helps engineers characterize and fine tune process conditions to improve process equipment performance for higher yield.
Process development, Process qualification, Process tool qualification, Process tool matching
Lithography track systems, Temperature controlled wafer chuck systems and ovens | -150-300°C
Process Probe? 1840/1850
In Situ Wafer Temperature Monitoring System
The Process Probe? 1840 and 1850 instrumented wafers provide high accuracy, real-time hot plate temperature measurements, supporting processes such as photoresist track systems and wafer probers. The Process Probe 1840 and 1850 allow direct measurement of wafer temperature stability and uniformity without dependence on imprecise process monitors or contact temperature sensors. With the Process Probe 1840 and 1850, lithography engineers can characterize and fine tune the photoresist bake temperature uniformity, ensuring that advanced lithography processes meet the temperature accuracy required for achieving high yield.
Process development, Process qualification, Process tool qualification, Process tool matching
Lithography track post-exposure bake, Spin-on anti-reflective coatings, Back end probers | 0-250°C (1840), 0-350°C (1850)
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